At Microsoft Research, we are shaping the future of AI infrastructure by pursuing high-risk and high-reward programs that will define the next generation of AI platforms. Our work spans the full stack, models, systems, software, and hardware, and we partner with product teams across Microsoft to turn research breakthroughs into impact at scale. Through close collaboration with industry partners, the team bridges research and production, translating hardware innovation into working prototypes and manufacturable solutions for next-generation AI infrastructure. You will join a multidisciplinary team working at the intersection of optics, electronics, photonics, packaging, networking, and AI system design.

We are looking for an Optoelectronics Engineer to join our team and drive the co-design of optical and electronic systems at the intersection of photonics, integrated circuit design, and signal processing.

In this role, you will help develop scalable, power-efficient connectivity solutions for next-generation data centre and AI systems, with a focus on co-packaged optics and advanced optical I/O technologies. You will have the unique opportunity to work hands-on with cutting-edge technologies while collaborating with R&D teams, Azure product teams, and Tier-1 partners to translate research innovations into deployable systems.

• This role is primarily based in the United Kingdom. Remote working may be considered in exceptional circumstances, at the organization’s discretion and in accordance with business requirements and employment policies.

Microsoft’s mission is to empower every person and every organisation on the planet to achieve more. As employees, we come together with a growth mindset, innovate to empower others, and collaborate to realise our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.

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  Design and develop high-speed optoelectronic systems, including optical transceivers and connectivity chip architectures.

• Perform system-level modelling and co-simulation of electronic, photonic, and packaging effects.

• Co-design electrical and optical interfaces, ensuring signal integrity, bandwidth efficiency, and power optimization.

• Develop and implement high-speed interface architectures, spanning host-side SerDes and parallel low-speed optical links, including analog equalization, clocking strategies, and link-level optimization.

• Design and simulate analog and mixed-signal CMOS circuits (e.g., drivers, TIAs, PLLs).Contribute to ASIC and IC design flows, including architecture definition, modelling, and verification. Collaborate with internal teams and external partners to support tape-outs, bring-up, and validation of silicon and photonic devices.

• Analyze experimental data, align it with simulation outcomes, and drive iterative design improvements to meet performance targets.

Required/Minimum Qualifications

• PhD in Electrical Engineering, Physics, Photonics, Optical Engineering, or a related field.

• Strong background in signal processing for communication systems, analog/mixed-signal circuit design, Integrated circuit (ASIC/CMOS) design

• Proven industry experience in the design and delivery of optoelectronic systems and integrated circuits.

• Experience with optical transceivers, connectivity systems, or advanced optical I/O architectures.

• Hands-on experience with lab measurements and characterisation (e.g., RF measurements, eye diagrams, BER testing).

• Strong experience in end-to-end link modelling and simulation, including circuit-level (SPICE) and system-level (Python-based) analysis.

• Ability to operate effectively in a multi-disciplinary environment.

• Excellent communication skills in English, both written and spoken, including the skill to clearly communicate technical results and justify assumptions to diverse technical audiences.

Additional or Preferred Qualifications

• Experience with co-packaged optics, optical interconnects, or data centre networking technologies.

• Demonstrated track record of taking designs from concept through tape-out, bring-up, and validation.

• Solid foundation in optical communication, including fibre transmission, channel impairments, and system-level trade-offs such as power, reach, bandwidth, latency, and reliability.

• Experience collaborating with external manufacturing partners and Tier-1 suppliers across design, fabrication, and system integration phases.